What was the challenge or problem to be solved?
In industrial environments where electronic systems perform critical control and monitoring functions, the occurrence of failures in PCB boards and temperature sensors can directly compromise process stability and the reliability of the final product, making it necessary to carry out a PCB failure analysis to understand their origin. These types of incidents not only affect technical performance, but also introduce uncertainty in operational decision-making, especially when failures are not easily reproducible or exhibit intermittent behavior.
In this context, the identified problem was associated with deviations in temperature measurement, which led to inconsistencies in the system and potential control errors. The difficulty lay in determining whether the origin of the failure was in the sensor itself, in its interaction with the electronic board, or in external operating conditions. From INFINITIA, the objective was not only to identify the failure, but to provide a solid technical basis to improve system reliability and prevent future recurrence.
PCB failure analysis through electrical and structural integrity assessment
In industrial electronic systems, PCB boards constitute the physical and functional support for interconnection between components, so any alteration in their integrity can generate cascading failures. In this case, anomalies were detected that suggested possible electrical discontinuities or defects in joints, making it necessary to carry out a specific analysis focused on evaluating their actual behavior.
The client’s context was defined by the need to ensure stable operation under demanding conditions, where small variations in electrical signals could translate into measurement errors. This is especially critical in systems where the sensor signal must remain within narrow ranges to ensure control accuracy.
The electrical integrity of a PCB can be affected by manufacturing micro-defects that generate intermittent failures that are difficult to detect, and their early identification helps reduce validation iterations and avoid diagnostic errors.
In addition, the potential repeatability of the failure raised the hypothesis of a non-isolated issue, possibly associated with design, manufacturing processes, or operating conditions. This aspect increased the criticality of the analysis, as it implied a risk of systematic failure.
The analysis made it possible to address the problem from a functional integrity perspective of the PCB, considering both electrical and structural aspects, and establishing a basis for identifying relevant deviations from nominal conditions.
Failure characterization in temperature sensors and signal deviations
Temperature sensors play a key role in data acquisition for control systems, so any deviation in their signal can compromise overall system performance. In this case, inconsistencies in the readings were observed, indicating potential issues related to accuracy or stability.
The objective of the project was to determine whether the origin of the failure was in the sensor itself, in its integration within the PCB, or in external factors such as interference or specific thermal conditions. This differentiation is critical for defining effective corrective actions.
Additionally, the aim was to evaluate sensor behavior under real operating conditions, as certain failures may not appear in controlled environments. This required an approach that considered the interaction between the component and the system.
The analysis made it possible to identify signal deviation patterns and establish correlations with possible degradation or interference mechanisms, providing a more complete understanding of the problem.
Root cause diagnosis in electronic systems with intermittent failures
One of the main challenges of the project was the complex and intermittent nature of the failure, which made it difficult to identify using conventional methods. This type of problem requires a structured approach based on root cause diagnosis.
The coexistence of multiple variables, such as thermal conditions, electrical behavior, and potential manufacturing defects, required the formulation of different hypotheses and their validation through experimental evidence. This avoids conclusions based on unverified correlations.
From INFINITIA, the problem was addressed by integrating knowledge from different disciplines, enabling the system to be analyzed from a global perspective. This approach is key to solving complex electronic failures.
Intermittent failures require hypothesis validation under controlled conditions, as they are not always reproducible in standard tests, so an evidence-based approach allows critical variables to be isolated and prevents unverified conclusions.
The result was the identification of critical factors contributing to the failure, enabling the establishment of causal relationships rather than merely descriptive ones, which is essential for technical decision-making.
How was it addressed or what was the solution?
To address the problem, a strategy was defined based on the combination of experimental analysis and comparative evaluation between samples with correct (OK) and defective (NOK) behavior. This approach makes it possible to identify significant differences that help explain the origin of the failure, avoiding unsupported interpretations.
From INFINITIA, a structured analysis was proposed, integrating material characterization techniques, electrical evaluation, and functional analysis, with the aim of obtaining a complete view of the system and understanding the interaction between its different elements.
OK NOK comparative analysis in PCB electronic failures
Comparative analysis between OK and NOK samples is a key methodology for identifying relevant differences in electronic systems. In this case, it was used to evaluate both PCB boards and temperature sensors, allowing the detection of deviations that would not be evident in isolated analysis.
This approach facilitates the identification of variations in materials, assembly processes, or electrical behavior, providing an objective basis for diagnosis. It is especially useful when complete information about the original design is not available.
Furthermore, comparative analysis allows the identification of failure patterns and correlations between different variables, helping to narrow down possible causes. This reduces uncertainty and improves diagnostic accuracy.
As a result, a clear understanding of the differences between functional and defective samples was obtained, enabling the analysis to focus on the most relevant factors.
Execution of failure analysis in electronic boards using characterization techniques
The execution of the analysis involved the application of different techniques aimed at evaluating both physical and functional aspects of the PCB boards and sensors. This multidisciplinary approach is essential in electronic failure analysis.
INFINITIA’s forensic engineering team carried out characterization tasks that made it possible to identify potential manufacturing defects, material degradation, or integration issues between components. Each of these factors can significantly influence system behavior.
The combination of physical characterization and functional analysis is key to understanding the real behavior of the system, as evaluating only one dimension of the failure can lead to incomplete diagnoses and technically weak decisions.
Special attention was given to maintaining the representativeness of real operating conditions, avoiding the introduction of variables that could alter system behavior. This ensures the validity of the results obtained.
The combination of techniques made it possible to build a solid evidence base, necessary to validate hypotheses and advance in failure diagnosis.
Improving PCB and sensor reliability through technical validation of the failure
As a result of the analysis, a detailed understanding of the mechanisms affecting system behavior was obtained. This made it possible to define actions aimed at improving the reliability of both PCB boards and temperature sensors.
The benefits of the project included not only solving the specific problem, but also generating technical knowledge applicable to future developments. This is especially relevant in industrial environments where repeatability is critical.
In addition, the analysis made it possible to establish technical criteria for component and process validation, reducing uncertainty in decision-making. This contributes to improving overall product quality.
Ultimately, the value of the project lies in the ability to transform a complex problem into an opportunity for improvement, enhancing system robustness and performance.
